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ISL59442
Data Sheet September 21, 2005 FN7452.2
1GHz, 4 x 1 Multiplexing Amplifier
The ISL59442 is a single-output 4:1 MUX-amp. The MUX-amp has a fixed gain of 1 and a 1GHz bandwidth. The device contains logic inputs for channel selection (S0, S1), and a three-state output control (HIZ) for individual selection of MUX amps that share a common video output line. All logic inputs have pull-downs to ground and may be left floating.
TABLE 1. TRUTH TABLE HIZ 0 0 0 0 1 S1 0 0 1 1 X S0 0 1 0 1 X OUT IN0 IN1 IN2 IN3 HIZ
Features
* 1GHz (-3dB) Bandwidth (VOUT = 200mVP-P) * 235MHz (-3dB) Bandwidth (VOUT = 1VP-P) * Slew Rate (RL = 525, VOUT = 5V) . . . . . . . . . . . . 1452V/s * High Speed Three-state Output (HIZ) * Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
* HDTV/DTV Analog Inputs * Video Projectors * Computer Monitors * Set-top Boxes * Security Video * Broadcast Video Equipment
Pinout
ISL59442 (14 LD SO) TOP VIEW
IN0 1 NIC 2 IN1 3 GND 4 IN2 5 NIC 6 IN3 7 A=1 14 V+ 13 S0
Functional Diagram
EN0 S0 EN1 S1 12 S1 11 HIZ EN3 10 OUT 9 NIC HIZ 8 VDECODE EN2 IN0 IN1 IN2 IN3 OUT
Ordering Information
PART NUMBER PART MARKING PACKAGE ISL59442IB ISL59442IB-T7 ISL59442IB-T13 ISL59442IBZ (Note) ISL59442IBZ-T7 (Note) 59442IB 59442IB 59442IB 59442IBZ 59442IBZ 14 Ld SO 14 Ld SO 14 Ld SO 14 Ld SO (Pb-free) 14 Ld SO (Pb-free) 14 Ld SO (Pb-free) TAPE & REEL 7" 13" 7" 13" PKG. DWG. # MDP0027 MDP0027 MDP0027 MDP0027 MDP0027 MDP0027
ISL59442IBZ-T13 59442IBZ (Note)
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2005. All Rights Reserved. All other trademarks mentioned are the property of their respective owners.
ISL59442
Absolute Maximum Ratings (TA = 25C)
Supply Voltage (V+ to V-). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . V- -0.5V, V+ +0.5V Supply Turn-on Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . 1V/s Digital & Analog Input Current (Note 1) . . . . . . . . . . . . . . . . . . 50mA Output Current (Continuous) . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA ESD Rating Human Body Model (Per MIL-STD-883 Method 3015.7). . . . . .3kV Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .300V Storage Temperature Range . . . . . . . . . . . . . . . . . .-65C to +150C Ambient Operating Temperature . . . . . . . . . . . . . . . . . -40C to 85C Operating Junction Temperature . . . . . . . . . . . . . . .-40C to +125C Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves JA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. If an input signal is applied before the supplies are powered up, the input current must be limited to these maximum values.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER GENERAL IS
V+ = +5V, V- = -5V, GND = 0V, TA = 25C, Input Video = 1VP-P & RL = 500 to GND, VHIZ = 0.8V, Unless Otherwise Specified CONDITIONS MIN TYP MAX UNIT
DESCRIPTION
Supply Current (VOUT = 0V)
No load, VHIZ = 0.8V No load, VHIZ = 2.0V
14.5 12
18 15.5
20 17.5
mA mA V
VOUT IOUT VOS Ib Rout
Positive and Negative Output Swing Output Current Output Offset Voltage Input Bias Current Output Resistance
VIN = 3.5V, RL = 500 RL = 10 to GND
3.2 80
-2
3.44 120
9 -2.5 1.4 0.2 10
180
20 -1
mA mV A M M
VIN = 0V HIZ = logic high, (DC) HIZ = logic low, (DC)
-5
RIN ACL or AV ITRI LOGIC VH VL IIH IIL AC GENERAL -3dB BW
Input Resistance Voltage Gain Output Current in Three-state
VIN = 3.5V VIN = 1.5V, RL = 500 VOUT = 0V 0.999 -35
1.001 6
1.003 35
V/V A
Input High Voltage (Logic Inputs) Input Low Voltage (Logic Inputs) Input High Current (Logic Inputs) Input Low Current (Logic Inputs)
2 0.8 50 90 2 150
V V A A
-3dB Bandwidth
VOUT = 200mVP-P, CL = 1.6pF VOUT = 2VP-P, CL = 23.6pF, RS = 25
1.0 235 100 35 0.01 0.02 1452 1124
GHz MHz MHz MHz % V/s V/s
0.1dB BW
0.1dB Bandwidth
VOUT = 200mVP-P, CL = 1.6pF VOUT = 2VP-P, CL = 23.6pF, RS = 25
dG dP +SR -SR
Differential Gain Error Differential Phase Error Slew Rate Slew Rate
NTC-7, RL = 150 NTC-7, RL = 150 25% to 75%, VOUT = 5V, RL = 525, CL = 23.6pF 25% to 75%, VOUT = 5V, RL = 525, CL = 23.6pF
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FN7452.2 September 21, 2005
ISL59442
Electrical Specifications
PARAMETER PSRR ISO V+ = +5V, V- = -5V, GND = 0V, TA = 25C, Input Video = 1VP-P & RL = 500 to GND, VHIZ = 0.8V, Unless Otherwise Specified (Continued) CONDITIONS DC, PSRR V+ and V- combined V = 4.5V to 5.5V f = 10MHz, Ch-Ch X-Talk and Off Isolation, CL = 1.6pF MIN -50 TYP -57 75 MAX UNIT dB dB
DESCRIPTION Power Supply Rejection Ratio Channel Isolation
SWITCHING CHARACTERISTICS VGLITCH Channel-to-Channel Switching Glitch VIN = 0V, CL = 23.6pF, RS = 25 HIZ Switching Glitch tSW-L-H tSW-H-L VIN = 0V, CL = 23.6pF, RS = 25 2 135 30 28 mVP-P mVP-P ns ns
Channel Switching Time Low to High 1.2V logic threshold to 10% movement of analog output Channel Switching Time High to Low 1.2V logic threshold to 10% movement of analog output
TRANSIENT RESPONSE tr, tf Rise & Fall Time, 10% to 90% VOUT = 200mVP-P, CL = 1.6pF VOUT = 2VP-P, CL = 23.6pF, RS = 25 tS tPLH 0.1% Settling Time Propagation Delay - Low to High, 10% to 10% Propagation Delay- High to Low, 10% to 10% Overshoot VOUT = 2VP-P, CL = 23.6pF, RS = 25 VOUT = 200mVP-P, CL = 1.6pF VOUT = 2VP-P, CL = 23.6pF, RS = 25 VOUT = 200mVP-P, CL = 1.6pF VOUT = 2VP-P, CL = 23.6pF, RS = 25 VOUT = 200mVP-P, CL = 1.6pF VOUT = 2VP-P, CL = 23.6pF, RS = 25 0.69 1.4 6.6 0.46 0.92 0.52 0.97 8.3 13.3 ns ns ns ns ns ns ns % %
tPHL
OS
Typical Performance Curves VS = 5V, RL = 500 to GND, TA = 25C, unless otherwise specified.
5 4 3 NORMALIZED GAIN (dB) 2 1 0 -1 -2 -3 -4 CL INCLUDES 1.6pF BOARD CAPACITANCE 0.01 0.1 1 1.5 CL = 5.5pF NORMALIZED GAIN (dB) CL = 9.7pF CL = 7.2pF VOUT = 200mVP-P 5 4 VOUT = 200mVP-P CL = 1.6pF 3 2 1 0 -1 -2 -3 -4 -5 0.001 0.01 0.1 1 1.5 RL = 150 RL = 75 RL = 1k RL = 500
CL = 1.6pF
-5 0.001
FREQUENCY (GHz)
FREQUENCY (MHz)
FIGURE 1. SMALL SIGNAL GAIN vs FREQUENCY vs CL
FIGURE 2. SMALL SIGNAL GAIN vs FREQUENCY vs RL
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FN7452.2 September 21, 2005
ISL59442 Typical Performance Curves VS = 5V, RL = 500 to GND, TA = 25C, unless otherwise specified.
5 4 3 NORMALIZED GAIN (dB) 2 1 0 -1 -2 -3 -4 CL INCLUDES 1.6pF BOARD CAPACITANCE 0.01 CL = 23.6pF CL = 11.6pF CL = 16.6pF NORMALIZED GAIN (dB) VOUT = 2VP-P RS = 25 5 4 3 2 1 0 -1 -2 -3 -4 1 1.5 -5 0.001 0.01 0.1 1 1.5 RL = 500 RL = 150 RL = 75 RL = 1k VOUT = 2VP-P CL = 23.6pF RS = 25
(Continued)
-5 0.001
CL = 28.6pF 0.1
FREQUENCY (MHz)
FREQUENCY (MHz)
FIGURE 3. LARGE SIGNAL GAIN vs FREQUENCY vs CL
FIGURE 4. LARGE SIGNAL GAIN vs FREQUENCY vs RL
0.5 0.4 NORMALIZED GAIN (dB) 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 CL INCLUDES 1.6pF BOARD CAPACITANCE 0.01 VOUT = 200mVP-P
CL = 9.7pF
0.2 0.1 NORMALIZED GAIN (dB)
CL = 7.2pF CL = 5.5pF
0.0 -0.1 -0.2 -0.3 RL = 1k -0.4 -0.5 -0.6 -0.7 0.1 1 1.5 VOUT = 200mVP-P CL = 1.6pF 0.01 RL = 150 RL = 75 0.1 1 1.5 RL = 500
CL = 1.6pF
-0.5 0.001
-0.8 0.001
FREQUENCY (MHz)
FREQUENCY (MHz)
FIGURE 5. SMALL SIGNAL 0.1dB GAIN vs FREQUENCY vs CL
FIGURE 6. SMALL SIGNAL 0.1dB GAIN vs FREQUENCY vs RL
0.5 0.4 0.3 NORMALIZED GAIN (dB) 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 CL INCLUDES 1.6pF BOARD CAPACITANCE 0.01 CL = 28.6pF VOUT = 2VP-P RS = 25 CL = 23.6pF NORMALIZED GAIN (dB) CL = 16.6pF CL = 11.6pF
0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 1 1.5 -0.5 0.001 0.01 0.1 1 1.5 RL = 75 RL = 150 VOUT = 2VP-P CL = 23.6pF RS = 25 RL = 1k RL = 500
-0.5 0.001
0.1
FREQUENCY (MHz)
FREQUENCY (MHz)
FIGURE 7. LARGE SIGNAL 0.1dB GAIN vs FREQUENCY vs CL
FIGURE 8. LARGE SIGNAL 0.1dB GAIN vs FREQUENCY vs RL
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FN7452.2 September 21, 2005
ISL59442 Typical Performance Curves VS = 5V, RL = 500 to GND, TA = 25C, unless otherwise specified.
20 10 0 -10 PSRR (dB) -20 -30 -40 -50 -60 -70 -80 0.3 1 10 FREQUENCY (MHz) PSRR (V-) PSRR (V+) (dB) VIN = 200mVP-P CL = 23.6pF RS = 25 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 100 1000 -110 0.001 0.01 0.1 1 3 6 10 100 500 OFF ISOLATION CROSSTALK VIN = 1VP-P CL = 23.6pF RS = 25
(Continued)
FREQUENCY (MHz)
FIGURE 9. PSRR CHANNELS
100 VOUT = 100mVP-P INPUT VOLTAGE NOISE (nV/Hz)
FIGURE 10. CROSSTALK AND OFF ISOLATION
60
RF = 500
OUTPUT RESISTANCE ()
50
10
40
30
1
20
10 0.1 0.1 0 0.1
1
10 FREQUENCY (MHz)
100
1000
1
10
100
FREQUENCY (kHz)
FIGURE 11. ROUT vs FREQUENCY
FIGURE 12. INPUT NOISE vs FREQUENCY
1V/DIV
1V/DIV
S0, S1
S0, S1
0 20mV/DIV 500mV/DIV 0 VOUT
0 VOUT 0
20ns/DIV
20ns/DIV
FIGURE 13. CHANNEL TO CHANNEL SWITCHING GLITCH VIN = 0V, RS = 25, CL = 23.6pF
FIGURE 14. CHANNEL TO CHANNEL TRANSIENT RESPONSE VIN = 1V, RS = 25, CL = 23.6pF
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FN7452.2 September 21, 2005
ISL59442 Typical Performance Curves VS = 5V, RL = 500 to GND, TA = 25C, unless otherwise specified.
(Continued)
HIZ 1V/DIV 1V/DIV
HIZ
0 100mV/DIV 400mV/DIV
0
0 VOUT
VOUT 0
20ns/DIV
20ns/DIV
FIGURE 15. HIZ SWITCHING GLITCH VIN = 0V, RS = 25, CL = 23.6pF
FIGURE 16. HIZ TRANSIENT RESPONSE VIN = 1V, RS = 25, CL = 23.6pF
160 120 OUTPUT VOLTAGE (mV) 80 40 0 -40 -80 -120 -160 TIME (4ns/DIV) CL = 1.6pF RL = 500 OUTPUT VOLTAGE (V)
2.4 2 1.6 1.2 0.8 0.4 0 -0.4 -0.8 CL = 23.6pF RS = 25 RL = 500 TIME (4ns/DIV)
FIGURE 17. SMALL SIGNAL TRANSIENT RESPONSE
FIGURE 18. LARGE SIGNAL TRANSIENT RESPONSE
1.4 POWER DISSIPATION (W) 1.2 1
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 1 1.136W POWER DISSIPATION (W) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 25 50 75 85 100 125 150 0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD
0.8 0.6 0.4 0.2 0
JA
SO 14 =8 8 C/ W
833mW
SO 14 12 0 C/ W
JA =
0
25
50
75 85
100
125
150
AMBIENT TEMPERATURE (C)
AMBIENT TEMPERATURE (C)
FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
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FN7452.2 September 21, 2005
ISL59442 Pin Descriptions
PIN NUMBER 1 2, 6, 9 3 4 5 7 8 10 11 PIN NAME IN0 NIC IN1 GND IN2 IN3 VOUT HIZ Circuit 1 Circuit 4 Circuit 1 Circuit 1 Circuit 4 Circuit 3 Circuit 2 EQUIVALENT CIRCUIT Circuit 1 Input for channel 0 Not Internally Connected; it is recommended this pin be tied to ground to minimize crosstalk. Input for channel 1 Ground pin Input for channel 2 Input for channel 3 Negative power supply Output Output disable (active high); there are internal pull-down resistors, so the device will be active with no connection; "HI" puts the output in high impedance state. Channel selection pin MSB (binary logic code) Channel selection pin LSB (binary logic code) Positive power supply
V+ LOGIC PIN VCIRCUIT 1. V+ OUT VCIRCUIT 3. 21K 33K + 1.2V GND. VCIRCUIT 2.
DESCRIPTION
12 13 14
S1 S0 V+
V+ IN
Circuit 2 Circuit 2 Circuit 4
V+ GND VCIRCUIT 4.
CAPACITIVELY COUPLED ESD CLAMP
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FN7452.2 September 21, 2005
ISL59442 AC Test Circuits
ISL59442 VIN 50 or 75 CL 2pF RL 500 VIN 50 or 75 CL 2pF ISL59442 RS 475 50 or 75 TEST EQUIPMENT
50 or 75
FIGURE 21A. TEST CIRCUIT WITH OPTIMAL OUTPUT LOAD
FIGURE 21B. TEST CIRCUIT FOR MEASURING WITH A 50 OR 75
INPUT TERMINATED EQUIPMENT
ISL59442 VIN 50 or 75 CL 2pF RS 50 or 75
TEST EQUIPMENT
50 or 75
FIGURE 21C. BACKLOADED TEST CIRCUIT FOR VIDEO CABLE APPLICATION. BANDWIDTH AND LINEARITY FOR RL LESS THAN 500 WILL BE
DEGRADED
NOTE: Figure 21A illustrates the optimum output load for testing AC performance. Figure 21B illustrates the optimum output load when connecting to input terminated equipment. Figure 21C illustrates back loaded test circuit for video cable.
Application Circuits
*CL = CT + COUT VIN 50 + CT 1.6pF COUT 0pF VOUT RL = 500
*CL: TOTAL LOAD CAPACITANCE CT: TRACE CAPACITANCE COUT: OUTPUT CAPACITANCE
FIGURE 22A. SMALL SIGNAL 200mVP-P APPLICATION CIRCUIT
VIN 50 + 1.6pF CT
RS 25 COUT 22pF
VOUT RL = 500
CL = CT + COUT
FIGURE 22B. LARGE SIGNAL 1VP-P APPLICATION CIRCUIT
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FN7452.2 September 21, 2005
ISL59442 Application Information
General
The ISL59442 is a 4:1 mux that is ideal as a matrix element in high performance switchers and routers. The ISL59442 is optimized to drive a 2pF in parallel with a 500 load. The capacitance can be split between the PCB capacitance an and external load capacitance. Their low input capacitance and high input resistance provide excellent 50 or 75 terminations.
Power-Up Considerations
The ESD protection circuits use internal diodes from all pins the V+ and V- supplies. In addition, a dV/dT- triggered clamp is connected between the V+ and V- pins, as shown in the Equivalent Circuits 1 through 4 section of the Pin Description table. The dV/dT triggered clamp imposes a maximum supply turn-on slew rate of 1V/s. Damaging currents can flow for power supply rates-of-rise in excess of 1V/s, such as during hot plugging. Under these conditions, additional methods should be employed to ensure the rate of rise is not exceeded. Consideration must be given to the order in which power is applied to the V+ and V- pins, as well as analog and logic input pins. Schottky diodes (Motorola MBR0550T or equivalent) connected from V+ to ground and V- to ground (Figure 23) will shunt damaging currents away from the internal V+ and V- ESD diodes in the event that the V+ supply is applied to the device before the V- supply. If positive voltages are applied to the logic or analog video input pins before V+ is applied, current will flow through the internal ESD diodes to the V+ pin. The presence of large decoupling capacitors and the loading effect of other circuits connected to V+, can result in damaging currents through the ESD diodes and other active circuits within the device. Therefore, adequate current limiting on the digital and analog inputs is needed to prevent damage during the time the voltages on these inputs are more positive than V+.
Capacitance at the Output
The output amplifier is optimized for capacitance to ground (CL) directly on the output pin. Increased capacitance causes higher peaking with an increase in bandwidth. The optimum range for most applications is ~1.0pF to ~6pF. The optimum value can be achieved through a combination of PC board trace capacitance (CT) and an external capacitor (COUT). A good method to maintain control over the output pin capacitance is to minimize the trace length (CT) to the next component, and include a discrete surface mount capacitor (COUT) directly at the output pin. For large signal applications where overshoot is important the circuit in Figure 22B should be used. The series resistor (RS) and capacitor (CL) form a low pass network that limits system bandwidth and reduces overshoot. The component values shown result in a typical pulse response shown in Figure 18.
Ground Connections
For the best isolation and crosstalk rejection, the GND pin and NIC pins must connect to the GND plane. The NIC pins are placed on both sides of the input pins. These pins are not internally connected to the die. It is recommended this pin be tied to ground to minimize crosstalk.
HIZ State
An internal pull-down resistor connected to the HIZ pin ensures the device will be active with no connection to the HIZ pin. The HIZ state is established within approximately 30ns by placing a logic high (>2V) on the HIZ pin. If the HIZ state is selected, the output is a high impedance 1.4M. Use this state to control the logic when more than one mux shares a common output. In the HIZ state the output is three-stated, and maintains its high Z even in the presence of high slew rates. The supply current during this state is basically the same as the active state.
Control Signals
S0, S1, HIZ - These pins are, TTL/CMOS compatible control inputs. The S0, S1 pins select which one of the inputs connect to the output. The HIZ pin is used to three-state the output amplifiers. For control signal rise and fall times less than 10nsec the use of termination resistors close to the part will minimize transients coupled to the output.
Limiting the Output Current
No output short circuit current limit exists on these parts. All applications need to limit the output current to less than 50mA. Adequate thermal heat sinking of the parts is also required.
V+ SUPPLY LOGIC POWER GND SIGNAL DE-COUPLING CAPS V- SUPPLY
SCHOTTKY PROTECTION S0 GND IN0 IN1
V+
V+ LOGIC CONTROL
EXTERNAL CIRCUITS
VV+
V+ V+ OUT VV-
V-
V-
FIGURE 23. SCHOTTKY PROTECTION CIRCUIT
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FN7452.2 September 21, 2005
ISL59442 PC Board Layout
The frequency response of this circuit depends greatly on the care taken in designing the PC board. The following are recommendations to achieve optimum high frequency performance from your PC board. * The use of low inductance components such as chip resistors and chip capacitors is strongly recommended. * Minimize signal trace lengths. Trace inductance and capacitance can easily limit circuit performance. Avoid sharp corners, use rounded corners when possible. Vias in the signal lines add inductance at high frequency and should be avoided. PCB traces greater than 1" begin to exhibit transmission line characteristics with signal rise/fall times of 1ns or less. High frequency performance may be degraded for traces greater than one inch, unless strip lines are used. * Match channel-channel analog I/O trace lengths and layout symmetry. This will minimize propagation delay mismatches. * Maximize use of AC de-coupled PCB layers. All signal I/O lines should be routed over continuous ground planes (i.e. no split planes or PCB gaps under these lines). Avoid vias in the signal I/O lines. * Use proper value and location of termination resistors. Termination resistors should be as close to the device as possible. * When testing use good quality connectors and cables, matching cable types and keeping cable lengths to a minimum. * Minimum of 2 power supply de-coupling capacitors are recommended (1000pF, 0.01F) as close to the devices as possible. Avoid vias between the cap and the device because vias add unwanted inductance. Larger caps can be farther away. When vias are required in a layout, they should be routed as far away from the device as possible. * The NIC pins are placed on both sides of the input pins. These pins are not internally connected to the die. It is recommended these pins be tied to ground to minimize crosstalk.
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FN7452.2 September 21, 2005
ISL59442 SO Package Outline Drawing
NOTE: The package drawing shown here may not be the latest version. To check the latest revision, please refer to the Intersil website at
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 11
FN7452.2 September 21, 2005

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